Chapter 43 Summary: Creating PCB Stackups In this chapter, the tradeoffs involved in creating a PCB stackup are detailed. Tradeoffs such as cost, manufacturability, impedance goals, crosstalk goals, and the need for adequate interplane capacitance and adequate signal routing layers are weighed, with adequate interplane capacitance as the starting point. Readers will learn tips for documenting and specifying the stackup so that everyone involved in fabricating the boards understands which parameters are important. Previous Chapter | Next Chapter